Are you in need of part numbers 13208E5864, 1N3086, 45L20, 961-0063, JHP112-25 from Cecom Lr Center, Electronic Industries Inc, Solid State Devices Inc, Semitronics Corp, Joint Electron Device Engineering manufacturers of NSN 5961000674247? ASAP Parts Online has the part number in stock and ready to be shipped. Along with NSN 5961000674247 corresponding part numbers, we have access to billions of premium parts such as Semiconductor Devic for the aviation, defense, and military industries. We are here to help streamline the process.
Alternative NSN: 5961-00-067-4247 |
Item Name:Semiconductor Devic |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 000674247 |
NCB Code: USA (00) |
Manufacturers: Cecom Lr Center , Electronic Industries Inc , Hollingsworth John R Co , International Rectifier Corporation , Joint Electron Device Engineering , Semitronics Corp , Solid State Devices Inc |
Part No Part No
|
Item Name Item Name
|
Manufacturer Manufacturer
|
QTY QTY
|
RFQ RFQ
|
---|---|---|---|---|
13208E5864 | semiconductor devic | Cecom Lr Center | Avl |
|
1N3086 | semiconductor devic | Electronic Industries Inc | Avl |
|
1N3086 | semiconductor devic | Solid State Devices Inc | Avl |
|
1N3086 | semiconductor devic | Semitronics Corp | Avl |
|
1N3086 | semiconductor devic | Joint Electron Device Engineering | Avl |
|
1N3086 | semiconductor devic | International Rectifier Corporation | Avl |
|
45L20 | semiconductor devic | International Rectifier Corporation | Avl |
|
961-0063 | semiconductor devic | Hollingsworth John R Co | Avl |
|
JHP112-25 | semiconductor devic | Hollingsworth John R Co | Avl |
|
RELEASE2820 | semiconductor devic | Electronic Industries Inc | Avl |
|
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | METAL |
ABHP | OVERALL LENGTH | 2 500 INCHES MAXIMUM |
ADAV | OVERALL DIAMETER | 1 031 INCHES MINIMUM AND 1 063 INCHES MAXIMUM |
AKPV | MOUNTING FACILITY QUANTITY | 1 |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCILJEDECCASE OUTLINE DESIGNATION | DO-30 |
AXGY | MOUNTING METHOD | THREADED STUD |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CCDG | OVERALL WIDTH ACROSS FLATS | 1 227 INCHES MAXIMUM |
CQJX | NOMINAL THREAD SIZE | 0 500 INCHES |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 200 0 MAXIMUM REVERSE VOLTAGE PEAK |
CTQX | CURRENT RATING PER CHARACTERISTIC | 150 00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200 0 DEG CELSIUS CASE |
THSD | THREAD SERIES DESIGNATOR | UNF |
TTQY | TERMINAL TYPE AND QUANTITY | 1 THREADED STUD AND 1 UNINSULATED WIRE LEAD WTERMINAL LUG |
ZZZK | SPECIFICATIONSTANDARD DATA | 80131-RELEASE2820 PROFESSIONALINDUSTRIAL ASSOCIATION SPECIFICATION |
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